Application of dispensing machine in chip packaging industry
- Categories:Industry news
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- Time of issue:2022-07-20 20:06
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Application of dispensing machine in chip packaging industry
(Summary description)The more precise the product, the stricter the control of its manufacturing process, the higher the requirements of its manufacturing process, and the higher the degree of automation in order to improve production efficiency. Taking the chip packaging industry as an example, in the packaging process, automated dispensing equipment must be used in many places for processing instead of manual dispensing.
- Categories:Industry news
- Author:
- Origin:
- Time of issue:2022-07-20 20:06
- Views:
The more precise the product, the stricter the control of its manufacturing process, the higher the requirements of its manufacturing process, and the higher the degree of automation in order to improve production efficiency. Taking the chip packaging industry as an example, in the packaging process, automated dispensing equipment must be used in many places for processing instead of manual dispensing.
One: Bottom filling
Many technicians have encountered such a problem. During the flip-chip process, because the fixed area is smaller than the chip area, it is difficult to bond. If the chip is subjected to impact or heat expansion, it is easy to cause the bump to break, and the chip will lose its proper performance. In order to solve this problem, it is necessary to inject organic glue into the gap between the chip and the substrate through an automatic glue dispenser, and then cure it, which not only effectively increases the connection area between the chip and the substrate, but also further improves their bonding strength. , has a very good protective effect on the bump.
Two: Die Bonding
PCB is very easy to shift during the bonding process. In order to avoid electronic components falling off or shifting from the surface of the PCB, it is necessary to use a fully automatic dispensing machine to dispense glue on the surface of the PCB, and then place it on the surface of the PCB. It is heated and cured in an oven, so that the electronic components can be firmly bonded to the PCB.
Three: Surface Coating
In addition, after the chip is soldered, it is necessary to apply a layer of epoxy resin with low viscosity and good fluidity between the chip and the solder joint through the automatic glue dispenser and cure, so that the chip not only improves the appearance A grade, and can prevent the erosion and stimulation of foreign objects, can protect the chip well, thereby prolonging the service life of the chip.
When packaging small items like chips, if manual dispensing is used, the dispensing speed cannot be slow, and it is difficult to control the amount of dispensing stably, which not only affects the production speed of the product, but also may cause problems. affect the quality of the product. Therefore, for such precision operations, automated equipment is the best choice for manufacturers.
Relevant information
JHX (Xiamen) Technology Co., Ltd.
TEL:18144153856 Manager Zhang
18959210736 Manager Qiu
18144153129 Manager Wang
FAX:0592-7262060
Mail:2992439667@qq.com
Address:Room 301, No.300-3, Tongji North Road, Tong 'an District, Xiamen City